Recently, Wang Zhijun, vice minister of the Ministry of Industry and Information Technology, said in an interview with the media about the development of China's chip industry. Since 2012, China's IC industry has grown at an average annual rate of over 20%. In 2018, the industry's sales amounted to 653.2 billion yuan. The technical level is also constantly improving.

At present, China's chip design level has increased by more than 3 generations. The Haisi Kirin 980 mobile phone chip adopts the most advanced 7-nanometer process in the world; the manufacturing process has been upgraded by 1.5 generations, the 32/28 nm process has achieved mass production, and the 16/14 nm process has entered. Customer introduction stage; storage chip has a preliminary layout, 64-layer 3D NAND flash memory chip is expected to be mass-produced in the second half of this year; advanced packaging test scale accounts for about 30% in the packaging and testing industry; high-end equipment and targets such as etching machine Breakthroughs in key materials.

However, Wang Zhijun also said that compared with the international advanced level, there is still a considerable gap in the overall design, manufacturing, testing and related equipment and raw material production of integrated circuits in China.

Wang Zhijun pointed out that in the next step, China will integrate the broader and deeper level into the global integrated circuit industry ecosystem. Adhere to the development of open innovation cooperation and promote the development of open innovation in all links of the industrial chain. Adhere to the optimization of the environment, opportunity sharing, equal treatment of domestic and foreign capital, strengthen intellectual property protection, and share the development opportunities brought by the Chinese market with the global integrated circuit industry.