Recently, Wang Zhijun, Deputy Minister of the Ministry of Industry and Information Technology of the People's Republic of China, talked about the development of China's chip industry in an interview with the media. He stated that China's integrated circuit industry has grown rapidly at an average annual rate of over 20% since 2012, with a total industry sales revenue of 653.2 billion yuan in 2018 and a continuous improvement in technological level.

Currently, China's chip design level has been improved by more than three generations, and the Hisilicon 980 mobile phone chip adopts the world's most advanced 7-nanometer technology; The manufacturing process has been upgraded by 1.5 generations, the 32/28 nanometer process has achieved large-scale production, and the 16/14 nanometer process has entered the customer introduction stage; The preliminary layout of storage chips has been carried out, and 64 layer 3D NAND flash memory chips are expected to be mass-produced in the second half of this year; The proportion of advanced packaging testing scale in the packaging and testing industry reaches about 30%; Breakthroughs have been made in high-end equipment such as etching machines and key materials such as targets.

However, Wang Zhijun also stated that compared to the international advanced level, there is still a considerable gap in the overall design, manufacturing, testing, related equipment, and raw material production of integrated circuits in China.

Wang Zhijun pointed out that in the next step, China will integrate into the global integrated circuit industry ecosystem on a larger scale and at a deeper level. Adhere to open innovation and cooperative development, and promote open innovation development in all links of the industrial chain. Adhere to optimizing the environment, sharing opportunities, treating domestic and foreign capital equally, strengthening intellectual property protection, and sharing the development opportunities brought by the Chinese market with the global integrated circuit industry.